Used ESEC 2008 xSC #9252501 for sale

ESEC 2008 xSC die bonder is a high-performance die attaching workstation designed for the most demanding advanced packaging requirements. By combining top-of-the-line vision technology and advanced control features, it provides an exceptional level of accuracy, efficiency and reliability. Designed for use in medium to large volume production environments, 2008 xSC die bonder provides excellent flexibility and versatility. It is capable of handling die sizes ranging from 4mm x 4mm to 12mm x 12mm and substrate sizes ranging from 8mm x 8mm to 40mm x 40mm. It also has a full range of conveyor heights and widths, allowing it to accommodate virtually any substrate. The high efficiency of ESEC 2008 xSC die bonder is made possible by its unique vision system. The system uses dual sensors to independently locate and measure the position of each die and substrate across the x and y axis. This provides for precise alignment, ensuring the highest levels of accuracy during the die bonding process. 2008 xSC die bonder also incorporates a range of control features designed to optimize productivity and throughput. These features include programmable process parameters, automated die sorting and feeder alignment, and a user-friendly GUI interface. ESEC 2008 xSC die bonder also operates in a temperature-controlled environment. This is important in helping to preserve the integrity of the die and substrate materials, ensuring reliable results and minimizing defects. In addition, 2008 xSC die bonder provides flexibility and cost savings by allowing the same die to be used on multiple substrates. Furthermore, its modular design allows for easy upgrades and customization. Together, these features make it an ideal solution for a wide range of die-bonding applications.