Used ESEC 2008 xSC #9398176 for sale

ESEC 2008 xSC is a die attacher for lead frames and multi-chip packages. It is a standalone, high-speed machine with a modular design. It is capable of automatically loading, aligning, and attaching die to lead frames. With an efficient and reliable production process, it offers high-speed productivity and accuracy with a minimized footprint. 2008 xSC is equipped with a proprietary die tray delivery equipment, ensuring a dependable and repeatable operation. It has a three-stage control system that utilizes a capacitive load cell, micro-droplets, and a programmable logic controller (PLC). This unit makes it capable of varying the dot size and pressure of the die attachment process, depending on the application requirement. ESEC 2008 xSC has features that improve its overall performance, such as a two-axis vision inspection machine for accurate poise alignment. It has a sophisticated XYZ tilt-axis robotics tool, which allows for precision setting of the die relative to the bonder. It is also equipped with a high-speed nozzle that maximizes efficiency. In order to make die attachment even more reliable and efficient, 2008 xSC also has a well-designed dispensing asset for adhesive film, lamination and/or underfill. Its dispensing model is suited for any kind of die, including high-aspect-ratio thumb die and small chips. The design of ESEC 2008 xSC is ideal for manufacturing environments. It is equipped with operating modes such as manual, semi-automatic and fully-automatic, giving users the flexibility to work in accordance with the application requirements. It is also compliant with the safety regulations of the relevant industry standards. In conclusion, 2008 xSC is a well-designed, high-speed die attacher that offers users maximum accuracy, reliability, and flexibility. It is ideal for multichip packages and lead frames, due to its cutting-edge features and design.