Used ESEC 2008 #293818845 for sale

ESEC 2008
Manufacturer
ESEC
Model
2008
ID: 293818845
Die bonder.
ESEC 2008 is a die attacher machine designed and manufactured by ESEC Corporation. It is used to attach and orient dies onto components and substrates. 2008 Die Attacher is a versatile, cost-effective method of die attaching. It is capable of attaching multiple dies of various types including standard, flip chip, wire bond, and CSP styles. Using its built-in robot, ESEC 2008 can accurately and precisely attach dies in any orientation. 2008 has a modular design and is operable in either manual or automated modes. Its fully automated equipment can handle up to 20 dies at once, making it well suited for large-scale applications. ESEC 2008 can accept a variety of die sizes and types, including those with JEDEC, EIAJ, and other common industry standards. It also has the ability to rotate dies to match the substrate's land pattern. 2008 has a joystick control system with a touchscreen display for easy operation. It also has a user-friendly Windows-based operating unit for programming and controlling the machine. ESEC 2008 has an accurcy of ±0.003 mm and a repeatability of ± 0.0005 mm. It is also capable of performing attachments with a force of up to 400N. 2008 is equipped with robust safety features such as emergency shut-off, light curtain protection, and an interlock machine that prevents machine movement if a hand is too close to the moving parts. It also has environmental protection systems to avoid damage from dust and particles that can accumulate on the substrate surfaces. ESEC 2008 is a well-performing and cost-effective solution for the placement and attachment of dies. Its precision, reliability, and modular design make it suitable for a variety of die-attachment applications. In short, ESEC Die Attacher is an effective and efficient tool for attaching dies to a variety of components and substrates.
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