Used ESEC 2008 #9056241 for sale

ESEC 2008 is a die attacher that is capable of bonding various flat and round dies to various substrates. The machine uses innovative 3D robot technology to ensure complete accuracy and control during the die attaching process. The built-in computerized control system allows for precise placement and creates consistent, repeatable bonds without sacrificing speed. 2008 can bond dies to substrates ranging in size from 0.004 to 0.375 inches (0.1 to 9.5 millimeters). It has a maximum cycle rate of 150 attachments per minute (2 attachments/second). The machine is capable of attaching dies in any orientation and with exact repeatability. ESEC 2008 features automatic feeders, which eliminates time-consuming operations such as manual loading and unloading of dies. It also has a vision system that is capable of detecting die position and orientation so the machine can quickly and accurately place the dies. The machine is designed to be easily integrated into existing manufacturing lines, such as those used in automotive and medical device production operations. It is equipped with built-in diagnostics to provide easy maintenance and quick problem resolution. The machine measures 35.4" x 35.4" x 57.2" (900mm x 900mm x 1450mm) and has a gross weight of 1,960 lbs (890kg). 2008 is a reliable and efficient die-attaching device that ensures accurate and repeatable die-bond results and increased production. Its intuitive design and user-friendly interface make it easy to use, even for those with little to no experience with die-attaching machinery. Additionally, its fast throughput, consistent performance, and low cost make it an attractive choice for manufacturers.