Used ESEC 2008 #9119583 for sale

ESEC 2008 is a die attacher designed to optimize die attachment and soldering processes. This innovative device features advanced electronic control for precise and reliable operation. With 5 axis motion capability, its fully integrated die bond accuracy-rated control equipment enables obtaining a perfect die attachment accuracy of up to 0.003 mm to any lead-frame material. The die attacher 2008 is equipped with a high speed scanning system to make sure that the die is properly centered and aligned before die attachment. It is fitted with a PFG sensor based digital vision unit which automatically determines alignment related to die and substrate size, giving accuracy up to 0.1 mm of lateral deviation. These highly advanced features are optimally combined to deliver the fastest and most precise die attachment solution available in the market. The device also has exceptional stability, thanks to its low resonance construction which ensures shake and vibration free performance which is essential for high accuracy operations. It's equipped with an ultra-precise stepping motor and controller which ensures to deliver smooth, consistent operation. ESEC 2008 also comes with an advanced temperature control machine which can be used to maintain specified temperature during soldering. The die betterer is user-friendly and easy to program and configure. It is compatible with multiple programming languages such as Python, Visual Basic and G code. 2008 offers a feature of programmed parameters which can be edited for later use, eliminating the need to customize every phase of the die attachment process. This ensures that die attachment process is done quickly, using the least amount of time and resources. Overall, ESEC 2008 from ESEC is an advanced die attacher that offers superior accuracy and stability in die attachment, with an exceptionally user-friendly design and great value for money. With its intuitive programming features, it is a top choice for die and soldering processes.