Used ESEC 2008 #9120968 for sale

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Manufacturer
ESEC
Model
2008
ID: 9120968
Die bonder DINP, ODC/PreIQC, PostIQC, FPD, WMP.
ESEC 2008 is a state-of-the-art, automated die atteching equipment. It is designed to provide precision die attachment, as well as efficient productivity and repeatable accuracy. It is capable of attaching a wide variety of die shapes and sizes, including flat, curved and spindle-shaped dies. The system utilizes a two-axis servo drive with positional accuracy of 0.0002 inch, combined with a high frequency vision unit and two-axis camera. 2008 is equipped with an intuitive human machine interface (HMI) and fully programmable control machine. The tool is able to identify, locate and attach products with high accuracy and precision. It is equipped with a powerful vision asset that captures images of die shapes and sizes and provides a full-color image for the operator. The images are then used to position the die within 0.0005 inches of its desired location. This precision allows for easy and highly consistent die placement. The model is also capable of handling all types of substrate materials. ESEC 2008's automated die attaching process starts with the introduction of the substrate material and the selection of the die to be attached. The equipment then uses the vision system to precisely locate the substrate's surface and the die's position in relation to it. Following that, the unit will automatically align the die and then attach it to the substrate. The complete process can be monitored and adjusted via the HMI. 2008 is suitable for a variety of applications, from medical device assembly and automotive components to electrical components. It is able to accommodate die sizes from 0.25" to 3" in diameter. The machine also has the ability to cycle up to 1500 die per hour, making it a powerful solution to ensure repeatable accuracy and consistent die placement. Overall, ESEC 2008 is an efficient and reliable automated die atteching tool, perfect for a variety of applications and offering precise positioning and high speed die attaching. It is designed for maximum production output and a consistent and reliable process.
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