Used ESEC 2008 #9120970 for sale

ESEC 2008 die attacher is a high-precision, automated die bonding equipment designed for die attach applications in the semiconductor and microelectronics industry. It is capable of accurately placing and affixing a wide range of die onto substrates at high speeds. 2008 is well-suited for applications requiring high volume production and cleanroom operation. ESEC 2008 features high resolution, improved precision, and repeatability for die attach applications. The system is able to locate each die precisely using a patented process called localized identification, which ensures optimum performance and high yields. The die is placed onto the substrate using ESEC die attaching head, which has multiple vision-guided motors and a high-resolution camera to accurately align the die to the substrate. The head has a high-speed vacuum unit, a die alignment checking machine, and a die positioning tool to ensure precise and consistent placement of the die. 2008 die attachment asset also features automated wire bonding and high-speed image recognition. The automated wire bonder rapidly bonds the circuit elements to the die using high-end bonding technologies. The high-speed image recognition model provides better accuracy by quickly checking the die layers and analyzing the position and orientation of the die to the substrate. ESEC 2008 features full control of the die position, pressure, and temperature. It offers process control and calibration to match the ideal conditions for die attach applications to ensure optimal bonding. An automated lift-and-load equipment is also included to ensure safe and reliable operation. 2008 is designed for use in high-volume production and cleanroom applications. It provides a reliable, repeatable, and adjustable die-attach solution to ensure maximum yields and reduced downtime in the long run. The system is highly efficient and environmentally friendly, making it a great choice for semiconductor and microelectronics industries.