Used ESEC 2008 #9124901 for sale

ESEC 2008 is an automated die attach machine specifically designed for attaching dies to lead frames. It is a versatile computer-controlled equipment that offers high accuracy, high throughput and low cost operation. The machine consists of multiple moving components that allow it to move the die over the frame, accurately place it in the exact position and then bond the sides with a solder material. To achieve the high accuracy and to ensure a uniform bond, 2008 uses a servo motor with a rotary head. The system is able to detect and correct any misalignment of the die, without the need for manual adjustment. The die attach unit includes a non-contact laser height sensor, which accurately measures the height difference between the lead frame components and the die. The height sensor is used to determine the correct placement of the die and to adjust the die for precision. The machine also includes an induction heating machine, which is used for shrinking and expanding the die. An onboard electrical current is passed through the die to ensure that it can securely adhere to the lead frame. ESEC 2008 die attach tool also utilizes a vacuum asset to accurately place and secure the die in the correct position. It can pick up and place up to 12 individual dies at once, ensuring high throughput and reducing cost. The machine is also equipped with several safety features such as an e-stop switch and emergency stop button. This allows for safe operation and prevents any unintentional damage to the die or lead frame. Overall, 2008 die attach model is an efficient and economical option for attaching accurate and reliable die to lead frames. It is able to achieve high accuracy and throughput without sacrificing cost and quality. This makes ESEC 2008 an ideal choice for any die attach application.