Used ESEC 2008 #9124904 for sale

ESEC 2008 is an advanced, highly reliable die attach equipment and solutions suitable for various applications. It is powered by a compact, high-resolution vision system and 10-axis motor and positioning systems. This efficient machine allows for an effective die attachment process and is designed for components such as Large Scale integration (LSI) and Very Large Scale Integration (VLSI) CSPs and Flip chips. The top-notch 2008 combines flexible, high-accuracy motion control with a vision unit that can provide critical processing feedback. The precision and monitor functions ensure that the right sequence of events is performed during the die attach process, for superior quality and repeatability. It features an intelligent robotic manipulator with built-in vision guidance, allowing the machine to handle die from different suppliers and locations. The optics include a high-resolution non-calibration camera that can easily handle warped substrates. ESEC 2008 also features an active motion head that ensures precise alignment, critical during die attach process. 2008 also features a low-magnetic signal-to-noise ratio, and is able to scan high-reliability small, medium and large devices. Additionally, it utilizes a unique thermal profile control and management machine that can precisely control and maintain the heat level of die over the entire attach cycle, without any loss of accuracy. This tool is also fully parameterized, so that users can customize the machine to their specific application needs. ESEC 2008 also boasts a wide range of advanced features such as a user-friendly graphical user interface (GUI) and a menu-driven setup. It also has a high-performing GUI asset with various setup levels, as well as fully automated process executions and traceability. This makes it ideal for continuous process optimization, and provides users with a reliable platform for product development and ongoing research. 2008 is an incredibly reliable machine, and has been proven to provide maximum value for money in terms of die attach process. Its versatility, accuracy, ease of set up and process automation makes it a valuable asset to any assembly line.