Used ESEC 2008 #9234203 for sale

ESEC 2008 is an attach die that is designed for single die attach applications. This effective device is able to receive die-on-tape wafers, ready for assembly, and place them accurately onto a substrate. It is a standard die attach machine, which uses precision robotics to place the die or component accurately onto the substrate before securing it with thermal and mechanical force. 2008 die attach machine is designed to work in combination with a specialized heating unit that provides temperature control. The die is placed between two heated surfaces prior to being mounted onto the substrate. This heating method ensures that the die is firmly secured in place as it attaches to the board. The heating unit is also adjustable and allows the temperature to be adjusted and tailored to the individual component. One of the key features of ESEC 2008 is its high force applied during the attachment process. It is able to exert an impressive 10 tons of force onto the die, which ensures that the die is accurately and firmly attached to the board. The force can also be adjusted depending on the component, so the optimum amount of force can be applied for the required substrate. The machine also comes with a vision system, which allows it to detect, measure and place accurately. This ensures that the die is correctly aligned onto the substrate and that it is placed accordingly. This system also includes an impairment station, which allows the components to be inspected prior to being mounted. Overall, 2008 represents an effective and efficient way of attaching single die components onto substrates. It is able to apply high levels of force and its vision system ensures accurate placement. This is all achieved with precision robotics and an adjustable heating unit, making it a great option for component assembly.