Used ESEC 2008 #9371977 for sale

ESEC 2008 is a state-of-the-art electronic die attach machine that is designed to quickly and accurately attach and/or rework die, packages and chips. As a part of the Electronic Equipment Assembly and Connectivity (ESAC) family of products, it allows for versatile bidirectional precision placement of components. 2008 is further capable of handling up to four placements, providing multiple points of contact for the task at hand. It is equipped with a floating shuttle system that can handle up to 15 application heads and tools, making for a very efficient die attach process. The unit has 4 main parts; the Shuttle, x-stage, z-stage and y-stage. The Shuttle is the part responsible for the pick and place of the die, packages and chips, while the x, y and z stages the stages and motion components that make up the entire machine. ESEC 2008 is capable of performing precise die bonding tasks with up to 4 bodies of material, with each body capable of multiple points of contact. This allows for more even distribution of pressure and exact placement of the die, packages and chips. The tool is controlled by an on-board computer which allows for very accurate tracking and programming of the die attach process. In addition to the very precise and accurate die bonding process, the asset offers a wide range of other features. These include a vacuum capability, 3-axis monitoring, vision model and an integrated laser marking equipment. 2008 also has a built-in failsafe mechanism which ensures that there are no errors in the program and that the quality of work is kept at a maximum. Overall, ESEC 2008 is a highly efficient and sophisticated system for die attach operations. It provides reliable results and an easy to use, intuitive interface making it well-suited for a wide range of applications. Its advantages over traditional die attach processes include increased accuracy, increased speed, increased reliability and a reduced risk of mistakes. Therefore, 2008 is an excellent choice for any assembly or rework operation that requires precise die placement.