Used ESEC 2008 #9395240 for sale

ESEC 2008 is an efficient and reliable die-attaching product that is designed to securely attach smaller packages or die to a substrate (e.g. printed circuit board, chip carrier or heat sink). It is a high-precision, fully automated die-bonding equipment that provides fast and accurate processes. It provides a range of options to customize die-attach processes and configurations; allowing users to find the best solution for their application. 2008 die-attach system is composed of several components each specially designed to ensure high performance and repeated cycle yields. The X-Y-Z precise driven head is responsible for positioning the substrate, die and adhesive. The accurate optic vision is used to align and place the die precisely in the substrate and adhesive. The indexer is the control module for the unit; it can set and modify variables such as die placement, accuracy and repeatability. In addition, ESEC 2008 die-attach machine also comes with a thermal curing oven to ensure the bonding is set and cured properly. The automated functions of 2008 provide a dependable die-attach process with fast and reliable attaches. The entire die-attach process is easily adjustable and repeatable, ensuring precise and accurate placement of components. Up to three die levels can be placed at once depending on substrate size, eliminating the need for manual placement. The tool can also be configured for die attach of ball grid arrays, from small connectors to large arrays, which ensures consistent performance across products. Moreover, the asset is highly efficient and simple to use. It is capable of managing up to 200 die a cycle, meaning that large-scale jobs can be handled quickly and easily. The workflow can be adjusted for any application, allowing new formats to be added with ease. ESEC 2008 offers flexibility and versatilities with its modular components, this allows the model to be tailored for various applications and components, as well as allowing for future technology upgrades. In conclusion, 2008 die-attach equipment offers reliable, repeatable, and quick die-attach processes with easy integration and configurability for various components and applications. The high performance, easy to use system makes it a great choice for anyone looking for an efficient die-attach solution.