Used ESEC 2100 SC #9359252 for sale

ESEC 2100 SC is a semi-automatic motorized die attach equipment suitable for attaching wire bond dies and small chip scale packages to a range of substrates. It is designed to be a cost-effective, easy to use and reliable solution for die attach applications. 2100 SC features a multi-axis robotic arm for precise die placement and a motorized Z-mill which drives die mounted material down towards the substrate. A wide range of attachments and heads can be used to suit a variety of tasks; these include X/Y/Z-axis nozzle assemblies, toe grippers, extended z-nozzles with vision focus cameras and adjustable vacuum pressure. Additionally, ESEC 2100 SC features a controller which has the capability to adjust the position of the die in increments as small as 0.1 um and to control the position of the substrate during die attach operations. 2100 SC is equipped with an adjustable substrate indexing system suitable for handling a wide range of substrates and prototypes. The indexer has a repeatability of ±0.5mm and can handle substrates up to 10mm thick and up to 400mm x 400mm in size. Furthermore, it is capable of applying the correct amount of stress to the die and substrate during die attach which ensures accurate and reliable bonding. ESEC 2100 SC is designed for easy maintenance with a built-in cleaning unit which runs periodically to reduce the build-up of debris on machine components. Additionally, the controller software is equipped with an array of diagnostic and statistical tracking capabilities to monitor the machine and detect any potential issues such as die misalignment or excessive substrate strain. All in all, 2100 SC is a cost-effective and reliable solution for die attach applications requiring a motorized die attach tool. It offers a wide array of advanced features and offers great accuracy, repeatability and reliability when attaching wire bond dies or small chip scale packages.