Used ESEC 2100 XP #293592586 for sale

ESEC 2100 XP Die/Lead Attacher is a highly efficient and reliable die bonder suitable for attaching all types of standard dies, leads and lead frames. It features a high-speed, positive-stop X-Y motion platform, providing the user with accurate and repeatable die placement. ESEC 2100XP offers a versatile range of bond head configurations. These include two transverse bond heads, capable of producing both parallel and perpendicular bonds, and two universal bond heads, capable of producing both parallel and perpendicular bonds in any orientation. The transverse bond heads provide an extremely low height profile, allowing the die to be placed as close as possible to the bond pad. The universal bond heads are capable of reaching difficult corners or tight areas within the die. The die holding options of 2100 XP include both a vacuum pen and a gripping arm. The vacuum pen provides accurate placement of the die and has the ability to hold one to six die at a time. The gripping arm, which can hold single die up to 16.0mm in size, gives the user the ability to adjust the die height in relation to the bond pad during the bonding process. 2100XP offers precision placement alignment capabilities with an on-board microscope and LED lighting for optimum viewing. The alignment capability provides the user with the ability to easily and accurately align the die and bond pad. ESEC 2100 XP has numerous process monitoring and control features, providing the user with real-time monitoring and data collection on their application. This includes temperature, force and dispense volume. Overall, ESEC 2100XP Die/Lead Attacher is a reliable and highly efficient die/lead attacher suitable for attaching a range of standard die. It comes equipped with a versatile range of bonding heads and die holding options, as well as several process monitoring and control features.