Used ESEC 2100 #9360924 for sale

ESEC 2100 is a fully automated Die Attacher and Wire Bonder for packaging semiconductor devices. It is a compact, high performance die attach and wire bonder designed to ensure the highest accuracy and speed. This machine is driven by a powerful PC-controlled motion control system that can accurately mount die onto substrates or leadframes using either gold wires or soft materials such as gold ribbon, kite solder or gold ribbon. 2100 features fast, easy and accurate die pickup and placement with its high accuracy P-axis and X-Y-Z positioning stages. P-axis is mainly used for positioning of the die on the substrate before the pick and place head locks the die for the the wire bonding process. The X-Y-Z stages allow for precise movement of the clamp head ensuring accurate die placement onto the substrate and leadframe. The machine also has a wire bonder with an active welding head for quickly and accurately bonding nickel, gold and copper wires. ESEC 2100 is also equipped with a digital pulsewidth modulation thermocoupler that controls the temperature of the die attach to ensure high quality die attach. This thermocoupler is used for the purpose of controlling the temperature of the die attach process in order to ensure a consistent bond. The thermocoupler ensures that there is a uniform thermal distribution across the entire die attach area. The machine is also equipped with a wide range of safety features such as a power-off system, an overvoltage alarm and emergency stop switch. This ensures the smooth operation of the machine in the event of any potential problems. The machine also has a system integration feature which allows it to be used in various types of systems and production lines. 2100 is a highly advanced and reliable machine. With its highly accurate die attach and wire bonder, it is capable of meeting the requirements of high-end semiconductor packaging applications. This machine offers a cost effective and reliable solution for bonding and attaching die to substrates and leadframes.