Used ESEC 2100FC #293645977 for sale

Manufacturer
ESEC
Model
2100FC
ID: 293645977
Flip chip bonder.
ESEC 2100FC is a highly advanced, automated, die-attaching equipment for versatile and cost-efficient assembly of fine pitch components. This system is designed for the automation of all die attach and flip-chip processes from pre-positioning to post-sorting, under and overmold, and glob top dam and fill applications. 2100FC features an advanced touch-screen controller, a flexibly configurable v-drive (variable-speed) unit and a dual-axis DCU (Die Centering unit). This machine provides accurate placement and reliable attachment of fine pitch die by using an optimized combination of compliance and force feedback systems. Using an intuitive graphical user interface, operators can easily adjust the tool settings to meet specific assembly requirements. The asset can be configured quickly and flexibly to allow it to accommodate a wide variety of substrate types, as well as a variety of die sizes and pitch. Additionally, an advanced non-contact vision model is available for die and substrate alignment, ensuring the highest degree of accuracy and repeatability. ESEC 2100FC is designed for reliable and efficient processing of high-speed attachment and overmolding applications. It includes a robust pick-and-place motion equipment that is able to handle very small, lightweight components without compromising performance. The integrated force feedback system is also able to ensure extremely precise placement at all times. Additionally, the unit can be configured for continuous working processes and combined with an array of industry-standard modules for a wide range of applications. The die-attachment process is monitored and controlled by the dual-axis DCU that ensures accurate die placement on the substrate in all stages of the process. Additionally, 2100FC is equipped with dual-zone adhesive dispense heads that provide extremely precise application of both thermosetting and thermoplastic adhesives, as well as underfill and glob top materials. ESEC 2100FC is designed to provide superior accuracy, tight process control and unsurpassed production yields. With its advanced integrated technologies and reliability, 2100FC is a highly cost-effective and efficient solution for high-volume die attach applications.
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