Used ESEC 2100FC #9219587 for sale

ESEC 2100FC
Manufacturer
ESEC
Model
2100FC
ID: 9219587
Flip chip bonders.
ESEC 2100FC Die Attacher is a high-speed and reliable automated die bonder designed to meet the needs of a wide variety of assembly processes. This flagship product of Elyon Corporation incorporates precision mechanical and optics components for accurate and repeatable die positioning. 2100FC is capable of die placement to within +/- 0.001 inch on each axis. This die attacher is capable of working with both Gold and Copper wire, as well as more exotic bonding materials such as Wedlof and Kovar. A range of die sizes can be utilized including small and large, as well as 1mm to 6mm pitch configurations. An intuitive software system allows for easy setup and parameter configuration. This encompasses a sequence of operations which are set up to suit each application. ESEC 2100FC is ideal for die and die face down applications and can be supplied with a range of optional accessories to improve mechanical accuracy and increase throughput such as custom tooling packages and upgraded vision systems. 2100FC boasts a fast heat up time and can bond in as little as 2 seconds. Its innovative design features multiple mode operations, including automatic and man-machine operations and optional pogo pin adapters. The durable steel frame and rigid construction of ESEC 2100FC provides environmental protection, and the conveyor can be configured to optimize cycle time. The integrated pre-aligner module performs precision alignment and pre-positioning on the X/Y axis, where the die is accurately located within 0.3 microns. The Z axis operation is automatically controlled with a laser positioning system. 2100FC is a robust and reliable machine for high speed and high accuracy die placement operations. Its modular design and easy operation make it ideal for a wide range of applications. Its accurate and repeatable die attachment provides maximum yields and ultimate process control. ESEC 2100FC is ideal for applications such as packaged devices, FPGA and ASICs, optical devices, circuit boards and other devices.
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