Used ESEC DB 2007 SSI Plus #293649378 for sale

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Manufacturer
ESEC
Model
DB 2007 SSI Plus
ID: 293649378
Vintage: 2005
Die bonder Type: D-350 (2) Planar monitors HP monitor 2005 vintage.
ESEC DB 2007 SSI Plus is a reliable and easy to use die attacher for productive and versatile bonding of different dies onto a variety of substrates. This machine is designed to offer an optimal precision, with a fast and automatic function that simplifies the bonding process. It has a short tack cycle, with a compact design to accommodate the tightest of production lines while the automated features enable efficient production. DB 2007 SSI Plus is equipped with an operator friendly touchscreen control panel which allows for convenient and precise operation. The machine offers a selectable range of bonding temperatures as well as a wide variety of security/design features such as heated dies, programming of heating and cooling times, auto-focus, motorized XYZ table, adjustable lens settings and more. For production, ESEC DB 2007 SSI Plus offers an efficient and reliable die bonding process, enabling users to manage the die attach process with ease. The built-in functions of the machine help to reduce downtime and improve product quality. The machine's wafer bonding capabilities allow for the use of both epoxy and solder die attach processes. DB 2007 SSI Plus is fitted with a X-Y driven conveyor belt which allows for precise alignment of dies and substrates. The machine is also equipped with an advanced vision system to monitor the incoming components prior to bonding and an automatic inspection system to validate the accuracy of the die attach process. It has advanced features such as a component clipboard to manage multiple programs and a multi-die program selection to suit the needs of various production environments. The machine is compatible with a variety of input and output devices, enabling integration into various programs. This is possible with a 19-inch touchscreen, a half-speed Ethernet port and an RJ45 10/100BASE-T for the connection of PCs. The machine also has an optional programmable electro static discharge (ESD) system which helps to keep static electricity at a minimum. ESEC DB 2007 SSI Plus is the ideal choice for reliable and precise die attach processes, offering operators precision and repeatability during production. With temperature control and advanced security features, the die attach process can be monitored with accuracy and speed, ensuring products of the highest quality.
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