Used ESEC IP 2007 IC8 Matrix #146071 for sale

ID: 146071
Wafer Size: 8"
Vintage: 2000
Die bonders, 8" Stack-Magazine (Input-Output) Lead Frame Marking Unit Pre- and Post- Bond Inspection Option: Wafer mapping Hardware Configuration: Pick and place Wafer handler Indexer Top stack loader Output magazine handler Leadframe marking unit Prebond / Postbond inspection Wafer mapping connectivity Technical Specification: Leadframe thickness: 0.1-0.4mm Leadframe width: 9-75mm Leadframe length: 120-260mm Multichip (range in X): Max 42mm 2000 vintage.
ESEC IP 2007 IC8 Matrix is an innovative die attacher that can be used to precisely place and bond semiconductor dice to their carriers and substrates. Its built-in image processor guarantees superior accuracy and consistent die placement, providing one of the most efficient, productive and cost effective solutions on the market. The IP 2007 IC8 is designed with a robust and durable electrical design that guarantees a high degree of reliability, enabling a low maintenance and service cost over the entire lifecycle. Its user friendly interface provides a simple setup and operation and its sophisticated design allows for a high level of accuracy and repeatability, enabling the user to meet the highest quality standards in the semiconductor market. The IP 2007 IC8 offers a unique, high-performance matrix vision equipment, capable of accurate and efficient alignment for a variety of die configurations, in a variety of sizes, shapes, materials and colors. The IP 2007 IC8 features advanced features such as room temperature alignment, automatic vision centering, and a full matrix fleet of magnifications, allowing all elements to be placed properly within the x-y plane. This enables the highest yield possible with assured accuracy and repeatability. The IP 2007 IC8 also features a highly programmable software-controlled vision system, allowing full control over vision parameters, enabling the user to fully customize their die placement process. With its wide range of user-programmable parameters, the user can configure the unit to place die rapidly and accurately, while consistently achieving optimal performance. In summary, IP 2007 IC8 Matrix is an advanced die attach machine providing superior accuracy and repeatability, enabling users to achieve the highest yields, fast and cost-effective die placement, resulting in a high-quality product. Its user-friendly interface and advanced vision tool allow for full customization and make it an ideal solution for die placement applications.
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