Used ESEC Micron 2 Series 15 #9119750 for sale

ESEC Micron 2 Series 15 die attacher is a die-bonding equipment ideal for connecting components to a printed circuit board (PCB) in a high-volume, low-cost process. It is designed for production lines where accuracy and consistency are required. The system is capable of attaching die up to 1.27mm in size with a 25μm bonding height. It features an X/Y placement accuracy of ±50 μm and a Z placement accuracy of ±7.5 μm. This ensures precise placement, enabling a high level of quality assurance. Micron 2 Series 15 is powered by a high-performance, multi-core processor, allowing it to process up to 150 die-attach bonds per minute. It is capable of controlling the temperature of the heated tool head to within ±2C over a wide range of temperatures, from ambient to 400C. This allows it to adjust the solder profile for a variety of die-attach materials, from lead-based to Pb-free. Additionally, the tool head is designed to be swappable, enabling the unit to be quickly and easily reconfigured for different die attach materials and sizes. ESEC Micron 2 Series 15 features three distinct bond heads - the high-flow, wedge, and standard bond head. The high-flow bond head enables larger-volume die-attach bonding with reduced cycle times. The wedge bond head allows for excessive material flow, while the standard bond head is ideal for high precision and repeatability. The machine also features an easier-to-use HMI, including a graphical user interface that supports the programming and operation of the machine. Additionally, it has an intuitive teaching mode that enables a user to quickly retrain it for different production needs. Furthermore, the tool offers multiple communication protocols, including USB and Ethernet, allowing for simpler integration with existing production systems. In short, Micron 2 Series 15 die attacher is ideal for high-volume, low-cost production lines requiring fast, accurate results and easy integration with existing systems. Its wide range of features and adjustable settings make it an ideal choice for time and cost-saving die-bonding solutions.