Used ESEC Micron 2 #102772 for sale

ESEC Micron 2 is a state-of-the-art die attacher that is used to bond multiple layers of small or large circuit boards together. It uses either a vacuum or manual tool to attach the dies to the substrates. The vacuum is used to ensure that the die is secured in place and that no air voids are present. Once the die is in place, the manual tool applies an epoxy adhesive to the die, which acts as a bond, securing it to the substrate. Micron 2 can handle multiple die sizes, from a few millimeters up to many centimeters. It also offers a versatile range of bond patterns, from standard one-layer bonding to more intricate multi-layer bonding. The versatile design allows for a wide variety of options when it comes to the number of layers and bond patterns, making it suitable for any circuit board project. The unique feature of ESEC Micron 2 is its modular mechanism, which allows the user to configure the attacher to work with a variety of substrates and dies with different thicknesses. It also allows the user to adjust the amount of force that is used when attaching the die, giving the user greater control over the process. Micron 2 also includes precise feedback monitoring, so that users can better manage their machine's operation. To simplify the process, ESEC Micron 2 also has a quick-change die holder, which allows for easy adjustment of the die size and makes the process of setting up dies much quicker and easier. This feature ensures that the machine is always ready for the next project. Overall, Micron 2 is an advanced and reliable die attacher that is capable of handling a wide range of projects. Its features and versatility make it an ideal choice for circuit boards that require multiple layers of different sizes and intricate bond patterns.