Used ESEC Micron 2 #137013 for sale

ESEC Micron 2 is a high-speed die attacher which bonds semiconductor or passive devices to substrate carriers using adhesive or solder. This machine performs automated die attach operations, including die orientation and placement, while monitoring the position and alignment of the die with respect to the substrate in real time. Micron 2 can place up to 168 small die or 112 medium die on a single substrate or up to 63 large die on a substrate. It utilizes vision alignment and a position detection equipment to precisely place the die accurately on the substrate while still providing high-speed bonding. ESEC Micron 2 also offers a wide range of features and capabilities, such as adjustable placement speed, auto-loading and unloading capabilities, auto-location and tool recognition, multiple substrate handling system, and diagnostics monitoring. Its ability to handle multiple substrates and tools makes it ideal for high-volume production. In addition, the machine's flexible setup allows for customization to accommodate various die size, pitch, and shapes. Micron 2 also offers a variety of integrated software capabilities, including multi-layer vision capability, traceability, substrate handling, diagnostics monitoring, data logging, and process optimization. With its advanced web-based user interface, unit administrators are able to create, monitor, and adjust the die attach process in real-time without the need for a PC. This is especially useful in mass production applications where consistent, quality results must be achieved. ESEC Micron 2 die attacher is fully compatible with the industry-standard testing and inspection systems and can be easily integrated into robotic assembly lines. Its compact size makes it suitable for use in confined spaces. All components used in the machine are designed for superior durability and the machine is backed by a service team dedicated to the highest quality customer service. Thanks to its features, Micron 2 is an excellent choice for production facilities needing consistently reliable and accurate die attach operations.