Used ESEC Micron 2 #137015 for sale

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ESEC Micron 2
Sold
Manufacturer
ESEC
Model
Micron 2
ID: 137015
Multichip bonder.
ESEC Micron 2 is a die attacher that is designed to facilitate the efficient assembly of components onto a die. The device, developed and manufactured by ESEC, is capable of attaching very small components to an area as small as 0.2mm in size with precision and accuracy. The device is programmable, allowing the user to create custom profiles to accurately place a component on the die. Micron 2 utilizes an electrostatic pneumatic technology to adhere components to a die with precision alignment. This technique uses an electrical charge to press the component onto the die, overcoming the need for mechanical or adhesive bonding. The pneumatic equipment uses compressed air to ensure accurate placement of the component to the die. ESEC Micron 2 also includes a die handling system, which is capable of gripping up to ten dies at one time. This includes a vacuum passage, which allows for controlled and accurate placement of the dies onto the substrate, as well as a conveyor unit for loading the die to the assembly process. The device is also equipped with a vision machine, which is able to detect alignment issues and misalignments to prevent costly errors. Micron 2 is designed for use in a wide range of applications, such as medical, communication, automotive and consumer electronics. Due to its design, the device allows for a quick, streamlined assembly process that is highly efficient. Its small footprint also allows users to place it in locations with minimal space. Overall, ESEC Micron 2 is an advanced die attacher designed to increase the efficiency and accuracy of small part assembly processes. Its programmability, die handling tool, and vision asset make it an ideal choice for small scale production operations in a variety of industries.
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