Used ESEC Micron 2 #9059020 for sale

ESEC Micron 2 is a die attacher for packaging in the semiconductor industry. It is used to attach dies to chip carriers or other substrates at a precise, repeatable speed and pressure. The equipment is capable of handling dies of any shape or size and can be used with both traditional and advanced technologies. Micron 2 features a high-precision air-bearing system for precise repeatable speed and pressure, ensuring the dies are accurately placed and securely attached to the substrate.. The control unit allows for automatic gap detection, along with path optimization, precise die orientation, and four-way position sensing. The machine is designed for use with flexible feeders and can accommodate a wide range of die sizes. ESEC Micron 2 has a compact design, making it ideal for use in tight areas. It also has a low profile, allowing for easy integration into existing production lines. The unit has a fast cycle time, enabling it to quickly process a high volume of product. The tool features an intuitive user interface, allowing for easy setup and operation. The touch-screen controls provide a simple way to adjust settings and calibrate the unit for optimal performance. It is also equipped with a diagnostic mode, allowing for fast and easy troubleshooting of issues. Micron 2 is a reliable, accurate and fast die attacher for a wide range of applications. It is designed to be easy to use and integrate into existing lines. With its precision accuracy and cycle time, the asset is suitable for high-volume production lines, delivering consistently repeatable results.