Used ESEC Micron 2 #9168289 for sale

ESEC Micron 2 is a state-of-the-art die attacher specifically designed for use in the semiconductor industry. It is capable of quickly and accurately attaching and bonding the MEMS chip dies to the wafer. The equipment is highly reliable, offering outstanding die attach speed and accuracy that helps ensure a consistent performance over time. Micron 2's die attach system can handle any type of MEMS chip dies and is capable of quickly and accurately bonding them to the wafer. It features a proprietary vision unit that provides optimal die placement accuracy. This ensures that the dies are perfectly aligned with the wafer for optimal performance. The die attach machine also includes a unique air-insulated heating process that offers a uniform heating profile for each die and wafer. ESEC Micron 2 is equipped with advanced programming software that allows for automated programming of the die attach settings. This ensures that the die attach settings are consistent for each die and wafer, and eliminates the need for manual programming. Additionally, the software provides a variety of diagnostic tests to help detect and diagnose any potential issues with the attach process. Micron 2 is designed to reduce the time and effort required to manufacture die-attach products, while still delivering high-quality results. It is also built with advanced safety features to ensure the safety of the user and the machine during operation. Additionally, the unit is easy to install and requires minimal maintenance and cleaning. In summary, ESEC Micron 2 is a reliable, high-speed and accurate die attacher. It boasts a number of features and benefits, including an advanced vision tool, automated programming, and a variety of safety features. Micron 2 is an ideal choice for any semiconductor manufacturer looking to maximize their production efficiency and reduce costs.