Used ESEC Micron 2 #9216987 for sale

ESEC Micron 2 die attacher is an innovative, automated assembly machine made to handle a wide variety of applications in the industrial world of manufacturing. Micron 2's precise and adjustable flow rate of material supply guarantees a higher placement accuracy and repeatability in all products. This allows companies to achieve superior die attach performance, even with higher-volume products. ESEC Micron 2 features a vertical assembly that uses a unique contacting technique to accurately attach, align, and align die for delicate semiconductors. This machine also features a rapid repeat cycle that allows for the highest placement consistency, which is critical for high-volume production. Micron 2 comes with a 44 kg hopper that utilizes low-pressure air blasting to dec&rat without causing damage to the die. This feature ensures impeccable results in product assembly. The machine uses a neodymium magnet when locating and aligning parts. It also uses a special vision system to recognize, identify, and correctly align die and substrates. Once die alignment is complete, the machine uses a four-position electric sealer to accurately place die and adhesives. ESEC Micron 2 has the capability to detect floating, misassembled, and off-height components, enabling it to accurately recognize faulty components and remove them from the assembly. With its innovative, powerful servo system, the machine can achieve up to three times higher typical designed placement rates and twice the number of placements compared to traditional industry machines like die bonding utensils and manual tin-solder tools. These features guarantee higher throughput of up to 400 ppm for 8 mm pitch and 350 ppm for 12 mm pitch. Micron 2 has a host of other features to assist in improving process control and product quality. It includes an automated process control system that allows programs to be quickly and accurately set-up. This machine also includes a high-volume feeder that is capable of handling die sizes from 0.4 mm to 5.0 mm and substrates up to 200 mm x 200 mm. A thin plastics dispenser (TPS) is also included, allowing parts to be applied to the substrate quickly and accurately. The TPS is also able to cover substrates in a variety of shapes, increasing productivity and accuracy. Overall, ESEC Micron 2 die attacher is a powerful, adaptable machine that can meet the most stringent requirements of industrial semiconductor manufacturing. It offers features and technology designed to allow companies to manufacture with greater efficiency and consistency while maintaining product quality and reducing cost.