Used ESEC Micron 2 #9227465 for sale

ESEC Micron 2 is an advanced, fully automated die attacher designed for use in the production of integrated circuits and microelectronic components. The accurate placement of tiny components is critical in producing quality semiconductor products, and Micron 2 is designed to do this quickly and accurately. ESEC Micron 2 features a high-precision robotic arm with a three-axis positioner, allowing for accurate placement of components in all directions. Controlled by a high-speed controller, the arm is capable of reaching feed speeds of up to 600mm/sec, allowing for fast, efficient chip placement. The die placement accuracy is less than 2.5um, and the repeatability is better than 25um as well. The device is designed for pick-and-place of various die packages, including SiP, SOP, QFP, SOIC, SSOP, DFN, and other sizes. A transport system is available to ensure reliable delivery of the die to the placement head. The transport system can be used with a variety of die types, and is compatible with standard handlers, trays, and magazines. Micron 2 is enclosed in a stainless steel casing, making it resistant to corrosion and other environmental influences. The system is compatible with GDS-II, and can be connected to a computer for remote control and programming. The device also comes with a graphical user interface software, which simplifies programming and monitoring of the device. ESEC Micron 2 is a reliable, highly accurate and fast die attacher that can be used to place small components with precision. The device is built with a durable, corrosion-resistant casing, and features a high speed robot arm and controller, allowing for precise placement of die packages. The easy-to-use graphical user interface makes programming and monitoring of the device simpler, and the compatibility with GDS-II allows for remote control and programming. The device is designed for use with a variety of die types and sizes, and is capable of providing die placement accuracy of less than 2.5um.