Used ESEC / ZEVATECH (Die Attachers) for sale

ESEC / ZEVATECH is a leading manufacturer of die attachers, which are essential equipment used in the semiconductor industry. Die attachers play a crucial role in attaching semiconductor chips to their respective packages or substrates. ESEC / ZEVATECH die attachers are known for their high precision and reliability. They feature advanced technology that ensures accurate placement and bonding of the die onto the package or substrate. These machines are equipped with multiple parameters control and vision systems that enable precise alignment and positioning of components. This level of precision is essential for achieving optimal electrical and thermal performance of the chip. One of the advantages of ESEC / ZEVATECH die attachers is their versatility and adaptability to various package types and sizes. They offer a wide range of options and configurations to accommodate different die and substrate requirements. The machines are also known for their high throughput, allowing for efficient production and increased productivity. Some examples of die attachers from ESEC / ZEVATECH include the Micron 2 and CT2000. The Micron 2 is a highly precise die bonder designed for small and medium-sized production volumes. It provides excellent placement accuracy and process control. The CT2000, on the other hand, is a fully automatic die bonder with advanced vision system capabilities, suitable for high-volume production. Overall, ESEC / ZEVATECH die attachers are trusted by semiconductor manufacturers for their superior performance, precision, and flexibility. They enable efficient and reliable die attachment, contributing to the overall quality and durability of semiconductor devices.