Used HITACHI CM 700 #9258939 for sale

HITACHI CM 700 is an intelligent die attacher designed for high speed production process. The high precision controlled process is achieved by optimized motion control. This machine can precisely attach die to a substrate using 'flip chip' technology. It uses high speed pick and place arms and a die separation equipment. The equipment is designed to maintain a high quality performance with a variety of assembly techniques, such as flip-chip, wire-bond, laser or stamp-weld processes. The machine is equipped with a vision system and a programmable simulator, which enables it to handle different processes quickly, accurately and correctly. The vision unit includes a CCD camera which is used to find the position of the component attaching to substrate and accordingly adjust the motion control to properly place the die. A force/travel/trace setter is also included with this machine to adjust the force, travel and trace parameters of the equipment. HITACHI CM-700 is also capable of automated die separation and pick-and-place. The die attaching procedure takes place over three operations: die separation, placement and fixing. The cutting force and operating direction of the cutting blade are controlled using the force/travel/trace setter. The position accuracy of attachment is improved by the vision machine which is used to locate components. Once located, the automatically controlled motion creates an accurate die placement. The third step entails the securing of the die in place. CM 700 is a reliable and cost-effective choice for assembly processes. The integrated vision tool and motion control allow the machine to be used in fast, accurate and repeatable processes. The die separation capability also enables the machine to handle a range of flip-chip processes. CM-700 is suitable for applications in various industries such as electronics, semiconductors, medical and automotive.