Used HITACHI DB-700 #9198876 for sale

HITACHI DB-700 is a die attacher for high-volume and high-speed bonding of small semiconductor chips. Primarily used in the semiconductor industry, DB-700 die attacher offers an ultra-fast and precise bonding process that is ideal for the rapid attachment of components to substrates or boards. HITACHI DB-700 die attacher has an intelligent design that can be mounted horizontally or vertically, and is designed with an optimized equipment for die pick up, alignment, and chip placement. This intelligent and varied design allows for multiple types of die to be simultaneously attached, as well as providing multiple configurations for user specific needs. To optimize production time, DB-700 attacher also has a dual/simultaneous pick and place system, allowing for simultaneous operation of the two stations. This dual/simultaneous pick and place unit ensures efficient bonding even when the required components differ in size and shape. HITACHI DB-700 attacher is equipped with a laser vision machine and an imageprocessing processor. The laser vision tool precisely captures and measures the placement locations of chips and substrates for accurate die attachment. The processor then compares the collected data to the pre-programmed data to accurately determine the best placement option. A high-speed Zaxis movement asset of DB-700 ensures high-precision and high-speed bonding operations. The Zaxis of the attacher can reach a maximum speed of 15mm per second, with an accuracy of ±0.2mm. The 2000 /minute stroke rate of the Zaxis provides reliable and accurate chip placement and ensures continuous production operations. HITACHI DB-700 is also equipped with an advanced monitoring model. This monitoring equipment constantly monitors production at different levels and sends an alert when a malfunction occurs. TheError event can be recorded and stored for future reference and analysis. In conclusion, DB-700 die attacher is an ideal choice for high volume and high speed production operations. With its highly intelligent and accurate design, it allows for reliable and accurate chip placement. It also has a high-speed Zaxis movement system and advanced monitoring unit for improved performance.