Used HITACHI DB-700 #9198877 for sale

HITACHI DB-700
Manufacturer
HITACHI
Model
DB-700
ID: 9198877
Wafer Size: 12"
Vintage: 2005
Die bonder, 12" 2005 vintage.
HITACHI DB-700 is an automated die bonding equipment that can be used to attach die quickly and accurately. This system is ideal for a wide variety of applications, including automotive, consumer electronics, telecommunication, aerospace, and medical device industries. DB-700 uses two linear stages to achieve high-speed die bonding and precise die placement. With a placement accuracy of ±25 μm at 10.7 s/die, the unit is capable of achieving high throughput. HITACHI DB-700 is equipped with a dual bonding head, allowing for the use of two different die sizes at once. This facilitates frequent changes in die sizes during production runs, making it ideal for use in high-mix, high-volume applications. The dual bonding head can accommodate die up to 7.0 mm in thickness, and with an improved optical machine, the tool is capable of handling finer pitch die. The asset also allows for manual adjustments to the alignment settings, providing operators greater control and flexibility when attaching die. DB-700 also features an optional air cooler, which helps to maintain die temperature during the bonding process. This cooler helps to extend die life and prevent component damage due to thermal shock. Additionally, the model includes a PEARL-O-CAT die recognition function, allowing users to detect and program the size of die before the actual die bond. For users' convenience, HITACHI DB-700 operates on a Windows platform, enabling users to easily modify the settings and store them for future use. In addition to that, the equipment also offers a programming setup from which the user can select different bonding strategies. Furthermore, a remote diagnosis connection allows the user to diagnose any errors, helping prevent downtime and reduce maintenance costs. Overall, DB-700 is a reliable, efficient, and versatile die-bonding solution. With its superior performance and easy maintenance, this system is ideal for a wide variety of applications. By allowing users to achieve precise die placement and extended die life, it provides customers with a cost-effective solution for their die requirements.
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