Used HITACHI DB-700 #9302872 for sale

HITACHI DB-700
Manufacturer
HITACHI
Model
DB-700
ID: 9302872
Die bonders.
HITACHI DB-700 is a high-speed, high-precision die attacher designed for efficient and cost-effective manufacturing operations. This advanced die attaching machine uses a servo-driven feed system to accurately and rapidly attach 3D dies to printed circuit boards (PCBs). With its advanced features and high-speed operation, DB-700 can reduce the time and effort required to complete PCB assembly and improve the reliability of the production process. HITACHI DB-700 features a three-axis motion control for accurate and rapid die placement. It is equipped with a 24-position die indexer and a 256-position substrate indexer for quick and efficient die pick-and-place operation. The indexers, along with the on-board camera system, can be used to recognize individual dies with a high degree of precision. DB-700 also comes equipped with a Vision Control System and Auto Correction Function (ACF) for recognizing metallic parts and correcting warpage. HITACHI DB-700 can accommodate a wide variety of dies, including BGA, COB, and Flip-Chip. It is designed for both high-volume production and prototyping applications, and can be configured with several part and die movement options including High-Speed Feeder, Low-Velocity Feeder, Quick Feeder, and Re-Flow Feeder. Additionally, DB-700 is equipped with Part Switching Tools that can quickly and conveniently change part types or sizes. The machine can also be configured with several optional accessories, including an Automated Stealth Mode, programmed to reduce detection by other machine systems; Automated Off-fset Function (AOF), which adjusts for misalignment of dies; and Automated Position Correction (APC), which can correct for distortions in the die's orientations. HITACHI DB-700's speed, accuracy, and versatility make it an ideal solution for mass-production operations. With its advanced features, the machine can accelerate the entire manufacturing process from start to finish, improving the reliability and efficiency of PCB assembly operations.
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