Used HITACHI DB-700 #9312080 for sale
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HITACHI DB-700 Die Bonder is a precision die attacher designed for the mounting, alignment and thermocompression of a wide range of integrated circuit components. This versatile die attacher offers high throughput machine operation with accurate and reliable die bonding. DB-700 is equipped with a ruggedized frame and servo motor providing precise positioning of the X and Y stages. The tables utilize AC servo motors with digital encoder resolutions of 0.25 um on the X-Y stages enabling HITACHI DB-700 to accurately fine position the component to be bonded. The combination of the products stiffness and precision positions ensure superior accuracy and repeatability while the Z axis servo motor has been designed for reliable high-speed vertical movement. The precision of this machine coupled with its quick tooling changeover equipment makes DB-700 ideal for high throughput production. HITACHI DB-700 utilizes a proprietary vision system to correctly locate the die on the substrate prior to thermosonic bonding or thermocompression bonding. The unit provides two types of inspection; a high resolution color image to precisely locate the die as well as a low resolution image for magnification purposes. With the vision machine, edge boundaries, trim marks, and center point alignment data can all be used to accurately align the die and substrate during bonding. DB-700 is capable of performing a variety of pre-heat processes, including laser heating, laser heat assisted die attach, and pre-pick & place. This machine also offers a wide range of parameter settings such as material heating, thermosonic and thermocompression bonding parameters. HITACHI DB-700's overall functionality helps operators to accurately position and bond various die types with ease and repeatability. DB-700 offers a wealth of features that make it an ideal choice for high volume production applications. This machine offers full automation, repeatability, high throughput, and accuracy. The propriety vision tool provides precise positional accuracy ensuring successful bond results. The parameters used for heating, thermosonic, and thermocompression bonding can be adjusted depending on the application, further improving result accuracy and repeatability. With its wide range of features and capabilities, HITACHI DB-700 Die Bonder is an ideal choice for die bonding operations.
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