Used HITACHI DB-700 #9394663 for sale

HITACHI DB-700 is an advanced die attacher specifically designed for fast die bonding operations. It is a fully automated system containing a unique, high speed, 4-axis, die-placement robot, with an advanced vision system, and extremely fast wire bonding capability. This versatile machine has a pick up speed of up to 1.5m/sec and is highly economical due to its low power and small size. The high speed, 4-axis robot of DB-700 is capable of extremely precise placement of die on substrates with accuracies of +/- 0.003mm. This robot is driven by independent linear stepper servo-motors, while the vision system is comprised of a stepper motor, a CCD camera and a dedicated software package. This allows HITACHI DB-700 to quickly detect any defects which may be present on the die such as cracks, bumps or other disfigured features. This automation significantly improves throughput and reduces variability while ensuring high quality seals every time. DB-700 also has an extremely fast wire bonding capability which is based on a high speed, four-axis, twin-head solution. This bonding resolution is capable of up to 5um and can be programmed to be very flexible in order to suit the shape of the dies, as well as the number of bonds required. This sophisticated method of bond formation reduces the chances of shorting and increases reliability for long-term usage. Furthermore, HITACHI DB-700 has a wide variety of external programmable I/O ports that allows the user to program in outside data and control systems. This automation ensures that the process is repeatable and accurate. It also allows for remote monitoring and remote access of the operations for better troubleshooting. Its extremely low power consumption makes DB-700 the perfect choice for high volume production environments. In conclusion, HITACHI DB-700 die attacher is an extremely advanced and reliable machine, built with the most sophisticated automation and control systems available. Its high speed robot, unique vision capability, and fast wire bonding make it the ideal choice for die bonding operations with a high reliability factor. Furthermore, its low power requirements allow it to be extremely cost effective, which makes it the perfect choice for any production environment.