Used HITACHI DB-700SM #9236028 for sale

HITACHI DB-700SM is a die attacher specifically designed for microelectronic packaging applications. This high-end tool is used to attach ultra-fine wire, ribbon, and epoxy die to semiconductor components in a fast, precise, and reliable manner. DB-700SM offers superior precision and accuracy for a variety of high-volume, high-precision die attachment applications. The unique, patented image recognition equipment of HITACHI DB-700SM allows for extremely fast die placement with accuracy up to 0.01mm. This system utilizes sophisticated pattern recognition algorithms to pick the best die placement position, providing uniform die placement for a wide variety of sizes and shapes of die. The precise die placement enabled by this unit is ideal for high-volume packaging applications, such as mobile phones, set-top boxes, and more. DB-700SM is also equipped with a variety of other features for added flexibility and enhanced performance. For example, the tool can be used to attach regular pieces of wire or ribbon, as well as dies with varying wire patterns, using different feeding options. In addition, the tool offers an automatic wire cutter, allowing for fast and efficient die positioning and cutting. HITACHI DB-700SM also features an intuitive touch-screen interface for easy operation and a software-based teaching mode for programming new die patterns. Additionally, the tool is capable of accommodating up to 2 feeders for multiple functions operation such as dispensing, wire cutting or chip placing. Furthermore, DB-700SM features advanced safety protection through its patented, auto-shutdown mechanism for over temperature conditions. The machine also employs a reinforced protection machine to ensure the highest degree of die protection available. Overall, HITACHI DB-700SM is the ideal tool for any die attach assembly and can greatly improve product quality and reduce manual labor. With its precise die placement and variety of features, DB-700SM is a valuable asset for any microelectronic packaging operation.