Used HITACHI / RENESAS CM 100 CSP #9312387 for sale

HITACHI / RENESAS CM 100 CSP is a die attacher used to attach a die to various substrates including ceramic, glass, and flexible circuits. This product is particularly suitable for low- to medium-volume production environments with a high degree of automation. The equipment is a multi-function machine designed to maximize operator convenience. It incorporates a vision system which allows for capture and recognition of the target substrate profile. This ensures that the die attaching process is accurate and consistent. The unit is also capable of actively controlling drive force and target height. This allows for reduced waste materials and improved process yields. HITACHI CM 100 CSP also includes an integrated inclinometer for die alignment and placement accuracy. This machine is especially useful when attaching low-k die, as it enables fast and efficient die attachment in a single operation. In addition, the tool includes a dual-stage, dual-axis transfer head that allows for more precise and rapid attachment of the die. In addition to the die attachment, the asset also includes several other features that make it suitable for small to medium volume production environments. These include management of component inventories, traceability of data, and optional storage of part number and other product data in the model. This helps ensure that each die is correctly attached to the target substrate, reducing potential errors. The equipment also includes an integrated choice of communications ports for interfacing with a variety of computers and other equipment. This enables a higher level of connectivity and integration with other equipment, making it easier to manage process performance and accuracy. It also allows for remote communication and data transfer with other devices. Overall, RENESAS CM 100 CSP is a comprehensive die attaching system. It includes several features to ensure process accuracy, control, and connectivity. These features make it suitable for low- to medium-volume production environments, providing commanding capabilities and features capable of meeting the high-end requirements found in a variety of assembly applications.