Used HITACHI / RENESAS CM 300 #9262275 for sale

HITACHI / RENESAS CM 300 is a high-performance die attacher designed for solid-state chip assembly onto substrate materials. This innovative, advanced equipment is the ideal solution for customers who need to attach die onto flexible and rigid substrates with high accuracy and precision. Equipped with industry-leading 350µm die placement accuracy, HITACHI CM 300 can easily handle the most challenging assembly requirements. RENESAS CM 300 is a full-featured die attacher, providing all the features and capabilities of an automated die attaching system. It has an intuitive touch panel display making it easy to monitor the system at all times and can be programmed for a wide range of processes. The machine is equipped with a quick-response global vision camera system to ensure accuracy and precision when placing components. Aside from that, CM 300 is capable of making multiple die placements in special DIP, BGA and CSP packages as well as full wafers. HITACHI / RENESAS CM 300 is designed to help decrease human labor cost and achieve the highest quality with consistent process repeatability no matter the requirements. In addition, this die attacher has a generous footprint that easily fits onto a production line and does not require excessive space compared to other die attach systems. It is able to work with various substrates and chips at high speed, featuring a setup time of just 15 minutes and a processing time of less than one second per die. HITACHI CM 300 is the perfect die attacher for users looking to manufacture the highest quality substrates, substrates that require embedded components, and substrates with advanced characteristics. With minimum setup time and industry-leading precision, this die attacher is the ideal choice for anyone looking to fulfill their requirements in terms of performance, cost-effectiveness, and accuracy.