Used HITACHI / RENESAS CM 700 #187061 for sale
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ID: 187061
Vintage: 2001
Die bonders
Productivity UPH; Max 3,000 [Process dependent]
Placement Accuracy X, Y; <±38um (3σ)
Software version: 01.076/01
Material applicable:
Leadflame/substrate Width: 25 to 95mm, Length : 130 to 260mm
Wafer 300mm, 200mm (Option)
Die X, Y: 3×3 mm to 25×25 mm
Magazine to Magazine and Stack to Magazine
Bond Method Face down, Heat compression
Bond tool Temperature up to 400℃
Bond force 7.8 to 147N (0.8 to 15 kgf)
Lamionation tool temp. up to 400℃
Lamination force 19.6 to 588N (2 to 60 kgf)
Pre-bake oven up to 300℃
Wafer Tape Expansion 2 to 20mm; (Programmable)
[wafer tape dependent]
Image Processing Grey scale pattern matching
Utility requirement:
Power AC200~240V, Single phase, 50A
Air 0.4MPa, min.
N2 0.3 to 0.5Mpa, 50 l/min
Vacuum -75kPa to -85kPa
Exhaust Flow rate : 300 l/min
Axes:
Loader/unloader motion
Index track motion
Die transfer motion
Wafer transfer montion
Wafer table movement
1st mount head /stage
2nd mount head /stage
1st bond force
2nd bond force
Appearance:
Light tower
Monitor
Case / spare parts
Pre-bake (width:74mm)
Pre-heat
Wafer table 8 / 12 "
Wafer cassette base ( 3 pin)
Bearing/slider
No Rubber tip holder 2.7x2.7
Mapping system:
Notebook
Rock key
No Mapping software CD
Floppy disk
Barcode reader
Operation & maintenance documents / machine function testing report
2001 vintage.
HITACHI / RENESAS CM 700 is a high-performance die attacher designed for ultra-fast and efficient die attach working conditions. This die attacher uses an advanced vision system which allows for precise positioning of the die to be attached to a target substrate, without the need for any manual intervention. Depending on the complexity of the die attach application, HITACHI CM 700 is capable of achieving attachment rates of up to 200 parts per hour, making it one of the most productive machines of its kind available on the market. RENESAS CM-700 utilises a two-stage head movement - Up/Down and Forward/Back - providing micro-precision control which is essential for perfect die alignments. All 3 axes movements are controlled by servo motors, offering rapid and accurate actuation for even the most complex die attach projects. Furthermore, a newly developed vision system developed by HITACHI is integrated, ensuring optimal accuracy and reliability when calibrating the die to the substrate. HITACHI CM-700 features an intuitive user-friendly interface, designed via a 10.4" LCD screen within an ergonomic arm that ensures the operator achieves maximum ease of operation and navigation throughout the entire working process. This, combined with its touch-sensitive keys, delivers a convenient working environment. Furthermore, it is compatible with a range of software packages, meaning it can be integrated into production lines quite easily. To achieve maximum safety and reliability, CM-700 is equipped with an automated monitoring system which constantly checks the proper functioning of all components as well as the accuracy of the die attach process. Moreover, to ensure perfect die attach quality, RENESAS also provides comprehensive Guarantee Management packages with every purchase. RENESAS CM 700 has been carefully designed to provide the most reliable and user-friendly die attach solution on the market, making it the perfect choice for any die attach application.
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