Used HITACHI / RENESAS CM 700 #293752809 for sale

HITACHI / RENESAS CM 700 is a high-end die attacher capable of achieving superior chip placing accuracy with high-speed and high-precision performance. It is equipped with a full-mold attachment equipment verified in highly reliable applications and process control technologies. This die attacher is designed with a high-speed, high-accuracy, and cost-efficiency of electronic components in mind. It has an optimal placement accuracy of ±3μm at 120Μm/sec speeds. HITACHI CM 700 works by using a built-in placement head that install single chips and BGAs on a substrate. Its placement accuracy and speed capabilities are achieved with an integrated vision system, high-speed servo motors, and a 200kHz image sensor head. The image sensor head can detect adhesive residue, microparticles and other dirt particles that might affect the process. The integrated vision unit is capable to accurately locate and align packaged parts wherever needed. An advanced feature of this die attacher is its Pre-Place nozzle cleaning function. This function removes any false chip weld and adhesive residue on the nozzle during placement for accurate overlapping and improved throughput. RENESAS CM-700 is also equipped with an advanced feed control machine, double ball checker and an advanced nozzle alignment tool to ensure highest chip placing accuracy. The double ball checker will verify ball positions on the substrate surface and then adjust accordingly to improve placement accuracy. The nozzle alignment asset also optimizes accuracy of the placement head. The nozzle Angle Jigging mode enables accurate nozzle head alignment in the Z-axis direction. Overall, HITACHI / RENESAS CM-700 is a high-quality die attacher that helps improve reliability of electronic components. It has a precision placement accuracy of ±3μm, speed capabilities of 120Μm/sec and is equipped with an integrated vision model, high-speed servo motors, a 200kHz image sensor head, a Pre-Place nozzle cleaning function, a advanced feed control equipment, double ball checker and an advanced nozzle alignment system. It is an ideal choice for achieving superior chip placing accuracy with high-speed and high-precision performance for your electronic components.