Used HITACHI / RENESAS CM 700 #9100922 for sale

HITACHI / RENESAS CM 700
ID: 9100922
Wafer Size: 12"
Vintage: 2004
Die bonder, 12", 2004 vintage.
HITACHI / RENESAS CM 700 is a high-tech, automated die attacher designed to provide precise, repeatable performance for automated die bonding processes. This precision attacher offers reliable wire bonding to ensure the highest wire yield and performance. It is equipped with a robust die placement equipment and a powerful image recognition system that allows for rapid, highly accurate die bonding. The die feeding unit on HITACHI CM 700 utilizes advanced servo motors and precision motion control for accurate die loading and placement. With a high speed and high throughput, RENESAS CM-700 can handle up to 48 slices of dies per cycle, which makes it an ideal tool for high-volume production. The motor also has the capacity to handle either adhesive or conductive materials. The die alignment machine on CM-700 features a high-resolution microscope, used in conjunction with a state-of-the art image processing tool. This asset performs precise die alignment for accurate die attachment and high-accuracy wire-bonding operations. RENESAS CM 700 also incorporates vision-guided robot feeding model into its design, allowing it to identify die placement more accurately. HITACHI / RENESAS CM-700 has a powerful wire-bonding equipment, featuring a combination of dual bond heads and high-quality wire handling systems for improved stability. Its dual bond heads offer a wide range of wire-bonding options, and the system can be quickly adjusted to meet the wire-bonding requirements of a variety of substrates. Furthermore, the wire-bonding process on CM 700 is highly repeatable, resulting in a consistent process and end result. Finally, the coverage of HITACHI CM-700 is excellent. Its small work area is perfect for intricate, complex die bonding operations. Its high accuracy also ensures exceptional die coverage and excellent wire yields. HITACHI / RENESAS CM 700 is a robust die attacher that is suitable for both manual and automated die-bonding processes.
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