Used HITACHI / RENESAS CM 700 #9253006 for sale

HITACHI / RENESAS CM 700 is an entry-level die attacher mainly used to attach a die to a leadframe or substrate. This machine is suitable for small to medium-sized tasks such as wire bonding and flip chip soldering. HITACHI CM 700 is engineered to offer dependable, high performance while minimizing cost and complexity. It is among the most reliable and competitively priced die attach equipment available today. It is an ideal equipment for wafer level packaging assembly and hybrid integration of chip-on-substrate and components. The machine utilizes a high-precision stage and a close-up camera vision system to pick and place the die. It features optimized tooling for a wide range of applications and can handle a die size as small as 0.9mm. RENESAS CM-700 die attacher is built with a semi-automatic die bonder mechanism to ensure precision bonding in varied conditions. The unit operates with no more than two manual operations, hence increasing efficiency and consistency of the process. The feeding and precision placement machine can speed up the production process effectively. Additionally, it has a highly configurable feeder for palletized die, strip, and array die with optional foam pick-up. The machine's robust feature set is targeted at manufacturers of high-performance semiconductor components. Utilizing advanced HD video systems, the machine is able to accurately detect die position and alignment relative to the target zone. HITACHI CM-700 die attacher boasts fast, flexible and accurate programming capability, allowing manufacturers to quickly tweak settings and optimize the process. It has a library of standard programs to speed up the setup process. Users can avail of the intuitive user interface to steer die handle settings and other important settings such as tooling, operating mode, die handling, thermal profile, and more. All these features make HITACHI / RENESAS CM-700 an effective and reliable die attacher for fast and efficient die bonding.