Used HITACHI / RENESAS CM 700 #9253789 for sale
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ID: 9253789
Vintage: 2006
SIP Mounter, 12"
Configuration:
Input station:
Magazine handling system
Lead frame / Substrate stacker
Interposer loading system
Interposer handling system
Pre bake unit: RT 300°C
Pre heat unit: RT 200°C
Die bonding system
Die lamination system
Output magazine handling system
Wafer handling system
Die pick and place system
Vision system
High speed bonding: 3600 UPH
Placement accuracy: XY < 38μM (3σ)
Mount method: Face down heat compression
Bond tool:
Temperature: Up to 400°C
Force: 7.8 to 147 N
Lamination tool:
Temperature: Up to 400°C
Force: 19.6 to 490 N
2006 vintage.
HITACHI / RENESAS CM 700 is a Die Attacher designed for attaching small semiconductor packages on printed circuit boards (PCBs). It is ideal for highly accurate mounting of various die packages, including BGA, QFN, SOT and other chip packages. The unit can handle a wide range of die packages and also provides a wide range of features, including automatic package recognition for accurate placement, a built-in sampler arm for easy and precise setup, and multiple vision and alignment systems for precise placement. Using a highly accurate coordinate moving equipment, HITACHI CM 700 supports very precise die placement. This system consists of a direct drive unit and a tool-less machine, which allows for quick placement and setup of various packages. The unit can also support automated package recognition and pick-and-place of chip packages. RENESAS CM-700 also features intuitive user interfaces, with full process prompts and an easy-to-understand graphical user interface. It is also equipped with a sampler arm which opens and closes during the placement process and can be driven with one hand. Additionally, the unit has monitors in place that can detect any interference, such as a mistakenly specified material. This safety feature then triggers a shutdown so that no incorrect placement is applied. RENESAS CM 700 also contains an advanced vision tool for die placement accuracy, combined with fine alignment for very precise placement. The vision asset supports both BGA and QFN packages and ensures that the die is placed accurately on the target surface. In addition, the unit's intuitive software core allows for a variety of specialized tasks and processes, such as programmed calls to external heater/resistor controllers, air gun controllers, and more. Overall, HITACHI CM-700 is the ideal die attacher for mounting small and precise die packages on PCBs. It is highly accurate, user-friendly and functional, and ensures that packages are placed accurately with minimal effort and maximum convenience.
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