Used HITACHI / RENESAS CM 700 #9360883 for sale

HITACHI / RENESAS CM 700 die attacher is an advanced electromechanical component-handling equipment. It is designed to precisely position and attach surface-mount components to a substrate. The system can handle a variety of semiconductor component packages, including DIPs, SOICs, TSOPs, and SOPs. It has a weight of 15 kg (33 lbs.), a dimension of 410 mm (depth) x 600 mm (width) x 200 mm (height), and a nozzles of 10 mm, 15 mm, 20 mm, 25 mm, and 30 mm. HITACHI CM 700 die attacher is equipped with a HITACHI vision unit and an intelligent vision machine (IVS). The vision tool uses an integrated image processing functions that simplifies inspections and settings. The IVS is designed to detect component irregularities and make out-of-specification components repositionable without taking extra time. This feature ensures quick and accurate feeder operation and reduces setup time. The vision asset also allows the machine to detect data codes from the carrier tape and extract un-programmable part numbers. RENESAS CM-700 die attacher can be used to attach components with a speed of up to 1000 Die per hour (DPH). It also has an advanced bonding head that can safely handle delicate, fragile parts. A high-performance nozzle enables the user to reduce cycle times, improve component placement, and boost production quality. This machine also offers a high level of durability and reliability. It is equipped with a dual redundant E-stop model and a position locking mechanism to limit access and keep components secure during operation. The tightest accuracy requirements are met with RENESAS CM 700's high-precision sub-micron accuracy. The equipment also has a built-in calibration system that maintains and monitors accuracy in order to maximize pick-up performance and prevent errors. HITACHI / RENESAS CM-700 die attacher is an excellent choice for high-volume production runs. It has been designed to reduce tolerances and enhance fidelity for superior performance. It is an ideal solution for medical and automotive component assembly applications.