Used HITACHI / RENESAS CM 700 #9388082 for sale

HITACHI / RENESAS CM 700 die attacher is an automated die bonding equipment used for die-attaching to a wide variety of chip carriers. It is designed to provide a high-speed, high-accuracy die attach solution, reducing the cost of die attaching and improving process time. The system consists of an integrated camera, die attach controller, and high-temperature head. The camera performs positional accuracy checks, inspecting both the chip carrier and die placement to ensure proper alignment prior to bonding. The controller provides up to five programmable and three manual stages of die attach either in combination or in sequence. The stages allow placement precision and controlled pressure optimization for repeatable die attach quality. The unit also includes a high-temperature head which can achieve temperatures of up to 500°C. An embedded RTD measures the die temperature during bonding. The machine is configurable for a variety of bonder heads including non-contact thermal tools and precision scriber tips for non-contact die attaching. The head configuration as well as pressure on the die can be controlled and monitored. The tool further includes unique features such as a die uplift prevention function that can reduce float caused by temperature differences. This reduces die float by automatically cancelling the upward force of the die on the chip carrier. Additionally, a deposition control feature helps to reliably attach die, even when deposition values deviate from the normal range. The asset also features anti-coring protection that prevents a dented die attachment after bonding. HITACHI CM 700 die attacher also features an intuitive user interface with touch screen and an automated language selection process. This allows users to easily select the necessary parameters with easy-to-use menus and scrollable previews. It is also equipped with an integrated high resolution color screen that provides a zoomed image for high-precision die positioning. Additionally, a review monitor allows data logging as a part of the quality assurance procedures. Overall, RENESAS CM-700 die attacher offers an efficient die bonding solution that is simple to configure and easy to use. With its use, it can significantly increase die attach accuracy, speed up the process, reduce float, and reduce costs, resulting in improved productivity of the die attach process.