Used HITACHI / RENESAS CM 700 #9399339 for sale

HITACHI / RENESAS CM 700 is a high-performance die bonder designed for various wire bonding applications, primarily used in semiconductor manufacturing. This machine uses an advanced, multi-axis equipment to precisely place die, ceramic and plastic packages, as well as heat sinks. Its compact design and accurate, repeatable performance make this die bonder an ideal choice for precision joining operations. HITACHI CM 700's Computer Automated Precision Axis Control (CAPAC) system gives the user the capability to program process parameters and monitor performance. Parameters are set through a simple Windows Developed software interface, which also allows for alignment monitoring and inspection. The touchscreen enables a wide range of configuration tasks, including setting process parameters, positioning, acceleration and deceleration, as well as fine alignment. The auto-repeat accuracy is less than one micron and wireloop height stability of +/- one micron over 10,000 cycles. RENESAS CM-700 is equipped with a modular spot soldering unit, allowing the user to choose between two and five spot nozzles with three different soldering head sizes. It also features an advanced, single-axis drive design with brushless motors, resulting in a reliable and consistent die bonding experience. The easy-to-use unit can handle a variety of wire loop sizes and materials, including gold, aluminum, and alloys. The powerful, integrated control machine provides temperature control and demand positioning, with real-time thermal control, assuring uniform heat input. Its advanced, digital signal processors feature three signal processing channels for more precise, reliable performance. Additionally, a built-in, SPC function offers statistical process control and traceability, ensuring the highest quality and reliability during the die attachment process. CM-700 is a versatile, high-performance die bonder suitable for all types of semiconductor devices. With its small foot-print, robust design, repeatable accuracy, and a wide range of process parameters, this die bonder is an ideal choice for precision wire bonding operations.