Used HITACHI / RENESAS CM 700 #9399380 for sale

HITACHI / RENESAS CM 700 is a die attacher designed for wafer level packaging and die assembly. It has a die capacity of up to seven and is equipped with a die pick-up, orienting, and placement system. HITACHI CM 700 uses a wet/dry (WD) bonding method and is able to reach temperatures of up to 1400°C, ensuring high quality and reliable die attachment. RENESAS CM-700 die attacher is controlled through a Windows based graphical user interface. The GUI is easy to use, allowing operators to quickly and easily control a wide range of functions, including parameter setting and operation status. HITACHI / RENESAS CM-700 also features automatic die placement, board monitoring, and heated shower with manual shut-off. The die placement accuracy of RENESAS CM 700 is 0.1mm and can be adjusted while die attach is in progress to ensure the highest placement accuracy. CM 700 has a repeat attachment accuracy of 0.03mm which ensures consistent and reliable die assembly. Additionally, it features in-die temperature control and PID adjustment to make die attach processing faster and more reliable. In addition to die attach, HITACHI CM-700 can also perform underfill, die leveling, and marking processes. The die leveling process is especially useful to ensure a uniform die surface for optimal contact and attachment. The marking process is also useful for determining product origins and for tracking die locations during the die attach procedure. Overall, CM-700 is an advanced, reliable, and efficient die attacher capable of delivering superior product quality and performance. Its high accuracy, repeatability, and automated controls make it an ideal choice for high volume die attach jobs and for more demanding, complex applications. HITACHI / RENESAS CM 700 is equipped with a wide range of safety features and provides high temperatures and bond strength for reliable die attachment.