Used HITACHI / RENESAS CM 700H #9152493 for sale
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ID: 9152493
Wafer Size: 12"
Vintage: 2007
Die bonder, 12"
Wafer loader
Die transfer
L/F Feel system
Pressure: 5 Kg/cm
Mount unit dry run
Lamination unit dry run
NG Tray function
No kit
M/H and M/S
L/H and L/S
Stacking
Wafer ring, 12"
Prebake
Mapping NB
Lamination stage heater
2007 vintage.
HITACHI / RENESAS CM 700H is a die attacher machine which is used in the manufacturing of integrated circuit (IC) substrates. The machine features a high core gripping mechanism and laser parameter optimization to help ensure accurate die attaching even at smaller chip size. HITACHI CM 700H supports up to 8 dies per feeder with a maximum die size of 12mm x 12mm. The die attach operation is handled by a 3-axis stepping motor that accurately places the dies in x-y-z planes with a maximum speed of 2.1 m/s. In addition, the machine has a dispensing equipment which accurately dispenses and fills low viscosity beads, enabling precise die placement with fewer misalignments. Furthermore, RENESAS CM 700H die attach process includes an advanced suction function that enables operators to perform pre-fluxing and post-fluxing operations efficiently. This function includes an accurate vision system which detects critical fluxing positions to ensure a precise flux flow rate. The machine has an efficient vision unit that automatically inspects each die attach process and displays the result on the human machine interface (HMI) for review. The inspection includes die coplanarity, tilt, and bond quality. Additionally, CM 700H can be connected to a host computer for monitoring and controlling remotely. The machine also includes built-in safety features such as an emergency stop switch, double protection fence, and an emergency power generator that shuts down the power in case of any failure. HITACHI / RENESAS CM 700H is highly reliable and durable, and its automated functions helps streamline the die attach process and reduce human errors, ensuring quality and consistent products.
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