Used HITACHI / RENESAS CM 700H #9182930 for sale
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ID: 9182930
Wafer Size: 12"
Vintage: 2007
Die bonder, 12"
Wafer loader
Die transfer
L/F Feel system
Pressure: 5 Kg/cm
Mount unit dry run
Lamination unit dry run
NG Tray function
No kit
M/H and M/S
L/H and L/S
Stacking
Wafer ring, 12"
Prebake
Mapping NB
Lamination stage heater
2007 vintage.
HITACHI / RENESAS CM 700H is a die attachment system that is used to securely adhering a die or a component to a substrate for semiconductor applications. This die attach machine uses an ultrasound welding process to attach the die to the substrate in a controlled temperature environment and also in precise location control. HITACHI CM 700H features a compact design that allows it to be used for both large and small die attaching needs. Its integrated heater ensures an operator's convenience and cost reduction when compared to convection heating. RENESAS CM 700H has a top-mounted, adjustable microscope stage with a motorized XY gears. This allows for precise, accurate placement of the die on the substrate and improved operator ergonomics during use. The die attach head of CM 700H is equipped with a scanner that continuously monitors the die attachment process for accuracy. In addition, the head also has two independent force sensors to ensure the optimal amount of force is applied to attach the die to the substrate. HITACHI / RENESAS CM 700H also has an integrated vision systems that automatically detects the position of the die attachment head as it moves across the substrate during the die attaching process. This helps to ensure accurate placement of the die onto the substrate. The control unit of HITACHI CM 700H includes an intuitive Windows-based user interface with touch screen that allows an operator to program the die attachment position and customize the parameters as needed. RENESAS CM 700H is also equipped with a system of air nozzles that assists in cooling the environment during die attachment, prevents heat shock, and helps improve cycle times. The machine's temperature sensors help to detect any issues that may cause damaging heat shocks or over-heating, protecting the die and substrate from damage. Finally, CM 700H is equipped with Built-in-Test (BIT) functions that enable spot tests and calibration of the machine. As with all machines, HITACHI / RENESAS CM 700H is designed to adhere to safety standards and minimize mishaps that may occur during operation. This allows for a safe and reliable die attaching process that is economical and efficient.
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