Used HITACHI / RENESAS CM 700H #9360868 for sale

HITACHI / RENESAS CM 700H is a dedicated die-attaching equipment that is designed to ensure the secure and accurate mounting of a wide range of semiconductor die on substrates and lead frames. This machine features an advanced, high-precision, die-attach head that is capable of accurate fine-pitch placement. HITACHI CM 700H gives users the ability to accurately adjust the distance between the die, substrate, and the lead frame. The machine also incorporates a high-performance vision system that allows for precise verification and identification via each individual picture. This unit is further integrated with a bright LED light source to allow for optimum viewing of each die. In addition, the vision machine also comes with a die-axis detection function that automatically determine the die position, size, and angle from each image. RENESAS CM 700H also features a superior placement platform designed to ensure stable performance even during complicated processes. This platform includes adjustable feed speed, controlled motion, and fine alignment control. In addition, the tool automatically adjusts pick-up pressure to ensure secure and reliable die placement. The heated vacuum design reduces warpage and improves pickup accuracy. CM 700H features an automation asset that enables users to quickly and efficiently assemble and disassemble parts. This model includes a wide range of tools for automatic die height adjustment, a tool container, and an automatic conveyor equipment. The automatic conveyor system eliminates human error and is able to feed substrates into the unit quickly and accurately. Finally, HITACHI / RENESAS CM 700H also includes features such as a user-friendly graphical interface and touch display. These features provide users with an intuitive and comprehensive overview of the die-attaching process. As a result, users can quickly monitor, confirm, and adjust their settings and processes. Overall, HITACHI CM 700H is an advanced and reliable die-attaching machine that is designed to ensure the secure and accurate mounting of a wide range of semiconductor die on substrates and lead frames. Featuring a high-precision die-attach head, an integrated vision tool, superior placement platform, automation asset, and user-friendly graphical interface, this machine provides professionals with an efficient and reliable die-attaching model.