Used HITACHI / RENESAS CM 700X #9160078 for sale

HITACHI / RENESAS CM 700X is a reliable and highly accurate die attacher used to accurately align and attach dies to substrates. It has a unique die-positioning alignment technology, enables precise and effective die placement in a wide array of substrates with a combination of Optical Micro Alignment (OMA) and Semiconductor Die Placement—Cyclic Motion (SDCM). HITACHI CM 700X is capable of placing dies down to 0.2 mm in pitch and 0.25 mm in height, allowing for superior device-level precision. RENESAS CM 700X has several features that make it a unique die-attaching solution. It offers a variety of package sizes ranging from 8.64 mm to 25.4 mm in height, and between 0.4 mm and 28 mm in width. An integrated X-Y motor drive with direct drive motors provides micro-level control for precise placement and alignment of small dies. Automated height adjustment of the nozzle and substrate, as well as a real-time view of die position, provide precise loading of dies in desired locations quickly and without damage. CM 700X utilizes an operator-friendly operation panel with touchscreen for easy system control and monitoring. Settings includes add/edit of substrate library, die recognition, substrate shape, lot counter, alarm view/reset, and nozzles status. Safety features such as a laser scanner guard, needle cover, and safety curtain prevent contact between the machine and its operator, and offer protection from foreign objects. HITACHI / RENESAS CM 700X can be integrated with other automatic material handling systems such as wafer sawing and packaging systems to create a comprehensive handling solution. It has a high-precision linear motor drive X, Y and Z axles with steel belt type of motion and an adjustable latency mechanism, allowing high-speed operation. HITACHI CM 700X's integrated vision system enables it to identify and locate substrates and dies quickly and accurately. RENESAS CM 700X provides excellent process flexibility, allowing for the adjustment of nozzle height quickly and easily for effectively improving die loading. In addition, its batch loading capabilities make it suitable for production use in manufacturing substrates and other semiconductor devices. It is reliable and cost-effective and offers superior performance for the production of high-end semiconductor devices.